There is a massive problem in the telecoms world where companies are struggling to keep products cool in a small and light form factor. Coupled with this, there is a massive push for the telco sector to reduce carbon emissions across the board. With the transition to 5G, traditional cooling technologies like Die-Casting and Bonded-Fin are seriously struggling to keep products like mMIMO radios cool, and the problem is only set to get worse. Enovus Labs saw a huge demand for a new cooling technology that reduces size, weight and carbon emissions, so we created Segri-COOL. We applied Segri-COOL to Analog Devices' mMIMO reference design and found it to be 20% smaller and 40% lighter than the incumbent solution, something we were very proud to show off at Mobile World Congress 2023 on the ADI stand!
Enovus Labs have designed thermo-mechanical solutions for some of the solar system's most extreme environments. Tough enough to survive shock, vibration and temperature extremes, our solutions have always been engineered to be compact and lightweight. We pieced together techniques and innovations from these cutting edge designs and and with this invented a new, lightweight, compact, and green thermo-mechanical solution we call Segri-COOL.
Due to its inherent efficiency, Segri-COOL is much smaller than the competition
Efficient by nature, Segri-COOL keeps your product cool in a much lighter package
Less materials and lower energy manufacture means Segri-COOL is the greener option
Watch Nick Jeffers, Co-Founder of Enovus Labs talk to Wisse Hettinga from eeNews about the benefits of Segri-COOL for the telecoms sector. We applied Segri-COOL to Analog Devices' massive MIMO reference design and were kindly invited to demonstrate it at ADIs booth at the world's biggest telco trade show; Mobile World Congress, Barcelona 2023. Massive thank you to ADI for hosting us!
[Video published by www.eenewseurope.com, produced by Wisse Hettinga]